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UV膜 UV Adhesive Plastic Films

簡(jiǎn)要描述:PN

DESCRIPTION

ADHESION (1)

ADHESION (2)

1020R

Ultraviolet Film (PVC), 95 microns thick (3.8 mils), supplied in

100 meter (330') rolls with backing (typical use - wafer

backgrinding or dicing)

  • 更新時(shí)間:2024-06-04
  • 產(chǎn)品型號(hào):
  • 廠商性質(zhì):生產(chǎn)廠家
  • 訪  問(wèn)  量:875

詳細(xì)介紹

PN

DESCRIPTION

ADHESION (1)

ADHESION (2)

1020R

Ultraviolet Film (PVC), 95 microns thick (3.8 mils), supplied in

100 meter (330') rolls with backing (typical use - wafer

backgrinding or dicing) (Note: very high Adhesive Strength

to begin with, desirable for dicing operations, then reduces to a very low Adhesive Strength level after exposure to UV light,

ideal for pick and place operations)

@30 mins

(Si) 375/20*

@24 hours

(Si) 308/14*

@30 mins

(Si) 320/15*

@24 hours

(Si) 247/12*

1027R

Super-High Tack Anti-static Ultraviolet Film (Poly Olefin) of 175 microns thick in 100 meter (330') rolls with PET backing

(typical use is for backgrinding or dicing)

@30 mins

(Si) 1850/28*

@24 hours

(Si) 1980/33*

@30 mins

(Si)2080/28*

@24 hours

(Si)2160/33*

1042R

Anti-static Ultraviolet Film (Poly Olefin) of 98 microns thick in

100 meter (330') rolls with Polyester backing (typical use is

for thin wafer dicing)

@30 mins

(Si) 300/25*

@24 hours

(Si) 550/28*

@30 mins

(Si) 300/10*

@24 hours

(Si) 600/10*

1043R

Anti-static Ultraviolet Film (Poly Olefin) of 168 microns thick in

100 meter (330') rolls with Polyester backing (typical use is

for thin wafer dicing)

@30 mins

(Si) 890/20*

@24 hours

(Si) 1042/60*

@30 mins

(Si)1035/15*

@24 hours

(Si)1105/28*

1044R

Anti-static Ultraviolet Film (Poly Olefin) of 268 microns thick in

100 meter (330') rolls with Polyester backing (typical use is

for thin wafer dicing)

@30 mins

(Si) 350/29*

@24 hours

(Si) 650/35*

@30 mins

(Si) 400/15*

@24 hours

(Si) 700/15*

(1) adhesion is measured at 30 minutes and 24hours after application to Stainless Steel, using grams per 25 mm width
(2) adhesion is measured at 30 minutes and 24hours after application to Silicon Wafer, using grams per 25 mm width
*These numbers are before curing adhesive levels/after curing adhesive levels.


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